For PCB PCBA Metal Heat-Sensitive Materials Ceramic Crystal Chip Packaging
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Epoxy Mounting Resin 2:1 Ratio Cold Mounting PCB Metal Industry Metallographic
Two-component epoxy cold-mounting resin kit for PCB, PCBA, metal, heat-sensitive materials, ceramic crystals and chip packaging. Simple 2:1 weight-ratio mixing with 50-120 min low-temperature cure and easy bubble removal.
Product overview
Two-component epoxy cold-mounting resin kit for PCB, PCBA, metal, heat-sensitive materials, ceramic crystals and chip packaging. Simple 2:1 weight-ratio mixing with 50-120 min low-temperature cure and easy bubble removal.
Key capabilities
Epoxy Mounting Resin 2:1
Simple 2:1 Weight Ratio Mixing
Cure Time 50-120 min Low Temperature
Easy Bubble Removal by Standing 5-10 min
Technical specifications
6 Technical specifications
Parameters shown here are taken from the product information supplied by Hadrick Technology.
- Product Type
- Epoxy Mounting Resin Kit (Resin + Hardener)
- Mix Ratio
- 2:1 by weight (Resin : Hardener)
- Cure Time
- 50-120 minutes, low-temperature reaction
- Applications
- PCB, PCBA, metal industry, heat-sensitive materials, ceramic crystal, chip packaging
- Usage
- Mix slowly clockwise, stand 5-10 min for bubble release, pour into silicone mold
- Brand
- SongYoo (松友)
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Two-component epoxy cold-mounting resin kit for PCB, PCBA, metal, heat-sensitive materials, ceramic crystals and chip packaging. Simple 2:1 weight-ratio mixing with 50-120 min low-temperature cure and easy bubble removal.