MODEL / Diamond Cutting Blade Ultra-ThinBRAND / SongYoo

Diamond Cutting Blade Ultra-Thin Precision Metallographic Sample Preparation for Crystal Ceramic Semiconductor PCB

Name: Diamond Cutting Blade Ultra-Thin Precision Metallographic Sample Preparation for Crystal Ceramic Semiconductor PCB
Brand: SongYoo

Ultra-thin diamond cutting blade with high precision and long service life, widely used in quality control, failure analysis and basic material research for crystals, ceramics, semiconductors, integrated circuits, PCB, glass and alloys. Available in resin-bonded, metal-bonded and electroplated diamond types, customized for different materials.

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Diamond Cutting Blade Ultra-Thin Diamond Cutting Blade Ultra-Thin Precision Metallographic Sample Preparation for Crystal Ceramic Semiconductor PCB 1 — Metallographic Consumables1 / 7

Product overview

Key capabilities

Diamond Cutting Blade Ultra-Thin

Ultra-Thin High Precision Long Service Life

Resin-Bonded / Metal-Bonded / Electroplated 3 Types

Customized for Different Materials

Widely Used in Crystal Ceramic Semiconductor IC PCB Glass Alloy

Quality Control Failure Analysis & Basic Material Research

Technical specifications

6 Technical specifications

Product Type: Diamond Cutting Blade (Resin-Bonded / Metal-Bonded / Electroplated)
Grade: Metallographic Precision Grade
Features: Ultra-thin, High Precision, Long Service Life
Applications: Crystal, Ceramic, Semiconductor, IC, PCB, Glass, Alloy
Usage: Metallographic sample cutting / Quality control / Failure analysis
Brand: SongYoo (松友) | Standard: Metallographic Grade

PRODUCT INQUIRY

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