Ultra-Thin High Precision Long Service Life
Verified product information
Diamond Cutting Blade Ultra-Thin Precision Metallographic Sample Preparation for Crystal Ceramic Semiconductor PCB
Ultra-thin diamond cutting blade with high precision and long service life, widely used in quality control, failure analysis and basic material research for crystals, ceramics, semiconductors, integrated circuits, PCB, glass and alloys. Available in resin-bonded, metal-bonded and electroplated diamond types, customized for different materials.
Product overview
Ultra-thin diamond cutting blade with high precision and long service life, widely used in quality control, failure analysis and basic material research for crystals, ceramics, semiconductors, integrated circuits, PCB, glass and alloys. Available in resin-bonded, metal-bonded and electroplated diamond types, customized for different materials.
Key capabilities
Diamond Cutting Blade Ultra-Thin
Resin-Bonded / Metal-Bonded / Electroplated 3 Types
Customized for Different Materials
Widely Used in Crystal Ceramic Semiconductor IC PCB Glass Alloy
Quality Control Failure Analysis & Basic Material Research
Technical specifications
6 Technical specifications
Parameters shown here are taken from the product information supplied by Hadrick Technology.
- Product Type
- Diamond Cutting Blade (Resin-Bonded / Metal-Bonded / Electroplated)
- Grade
- Metallographic Precision Grade
- Features
- Ultra-thin, High Precision, Long Service Life
- Applications
- Crystal, Ceramic, Semiconductor, IC, PCB, Glass, Alloy
- Usage
- Metallographic sample cutting / Quality control / Failure analysis
- Brand
- SongYoo (松友) | Standard: Metallographic Grade
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Ultra-thin diamond cutting blade with high precision and long service life, widely used in quality control, failure analysis and basic material research for crystals, ceramics, semiconductors, integrated circuits, PCB, glass and alloys. Available in resin-bonded, metal-bonded and electroplated diamond types, customized for different materials.